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Features |
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Plural semiconductors in one package offers downsized system with high performance and standardization. |
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Wiring space saving by multilayer fine patterns on build-up substrate. No signal delay by shortened wiring distance. |
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Development with surface mounting type Hybrid IC to consolidate SMD parts |
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High precision modules by function trimming. |
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Less mounting problem because of the decreasing number of the terminals. |
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Mounting Specifications |
Item |
Unit |
minimum |
Standard |
Maximum |
Note |
Substrate Dimension |
mm |
50×20 |
120×100 |
320×140 |
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Substrate Thickness |
mm |
0.3 |
- |
1.6 |
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Bare Chip Pad Pitch |
μm |
100 |
- |
- |
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Bare Chip Pad Dimension |
μm |
70 |
- |
- |
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Bare Chip Thickness |
mm |
0.1 |
0.2 |
- |
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Molding Height |
mm |
0.3 |
1.0 |
1.2 |
Height from the chip surface |
Wire Length |
mm |
0.3 |
- |
3.0 |
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Wire Loop Height |
μm |
100 |
200 |
- |
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Wire Diameter |
Al |
μm |
200 |
300 |
500 |
for Power Module |
Au |
20 |
25 |
40 |
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Plating |
Electrical/nonelectrical Au Plating |
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Substrate |
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FR-4 |
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FR-5 |
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Alumina |
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LTCC |
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FPC |
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Item |
Content |
Terminal Pitch |
0.8mm  |
Mountable device |
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SMD |
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Bare Chip |
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Printed Resistor |
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(Trimable)
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Package |
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SON |
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BGA |
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LGA
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Substrate for Package |
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FR-4 |
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FR-5 |
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Alumina |
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LTCC
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Application Notes
Brush up your circuit
Basic Knowledge
