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 Construction |
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Cavity |
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6. |
Thermal via |
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IC-chip |
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7. |
Inductor |
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Conductor pattern |
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8. |
Transmission line |
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Via |
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9. |
Buried resistor |
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Capacitor |
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10. |
Surface resistor |
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Features |
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Excellent size accuracy, by KOA's original
shrinkage control technology and multi layer technology. |
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The high-density wiring by the fine line
and pattern is available. |
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Miniaturization is possible by burying Inductor, Capacitor, Resistor and Transmission line. |
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By the uses of low dielectric-loss ceramics
and low loss conductors, the substrates excel in the high
frequency characteristic. |
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As the thermal expansion coefficient is
close to silicon's, the substrates are suitable for the bare
chip mounting. |
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By preparing the thermal vias under bare chips, the substrates are excellent in the heat dissipation. |
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The substrates are outstanding in heat resistance and humidity resistance due to the ceramics used. |
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Products meet EU-RoHS requirements . |
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Applications |
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Applications using high frequencies like
micro-waves, milli-waves etc. |
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Applications used in harsh environment,especially
in high temperatures etc. |
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Small size mobile communication modules. |
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Multi chip modules for bare chips. |
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MEMS packages. |
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Interposer substrates. |
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| Contact us when you have control request for environmental hazardous material other than the substance specified by EU-RoHS. |
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Shrinkage Control Technology |
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Although LTCC shrinks in the firing
process, KOA has realized the position accuracy in  0.05%
or less by precisely controlling the process and the material.
There are the following features in the KOA shrinkage control technology.
 The accuracy of the height direction is maintained, so the characteristics and accuracies of buried passive elements are outstanding.
 The high-accuracy cavity can be formed. |
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With the high functioning and
the advance in down-sizing of electronic equipment, wiring substrates
are also required to be highly functioned.
One of the technologies to respond to the high functioning of the
substrates is LTCC(Low Temperature Co-fired Ceramics), which is
the ceramic multilayer technology that enable the alumina to be
fired at a "low temperature " of 900 or lower by
adding glass materials to the alumina while it is fired by a "
high temperature " of about 1500 .
It is the LTCC 's important characteristic that low melting point
materials like Ag,etc.can be used for the buried conductors for
the low
temperature firing. |
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Characteristics of Substrate Material |
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Parameter |
Characteristics |
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Bending strength(MPa) |
250 |
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Thermal expansion coefficient(×10-6/K) |
5.5 |
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Thermal conductivity(W/m•K) |
3 |
Insulation resistance(  •cm) |
> 1013 |
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Dielectric constant at 1MHz |
7 |
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Dielectric loss at 1MHz |
< 0.003 |
Resistivity of buried conductor(μ •cm) |
Ag 2.5 |
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Density(g/cm3) |
2.8 |
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Surface roughness Ra (μm) |
< 0.4 |
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Withstanding voltage(kV/mm) |
> 15 |
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Layer thickness(μm/Layer) |
80, 100, 125 STD. |
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Symbol |
Parameter |
Design value |
A |
Line width
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0.06mm Min.
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B |
Line to line spacing
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0.06mm Min.
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C |
Via diameter |
0.1mm
,0.15mm
,0.2mm
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D |
Via pad diameter
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Via diameter+0.05mm Min. |
E |
Via to Via spacingVia pad diameter in the conductor
layer
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0.02mm Min.
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F |
Via pad to line spacing |
0.125mm
Min. |
G |
Part edge to conductor spacing |
0.2mm
Min. |
H |
Part edge to Via pad spacing |
0.3mm
Min. |
J1,J2 |
Cavity width |
0.6mm
Min. |
K1,K2 |
Cavity depth |
0.1mm
Min. |
L |
Wall thickness of cavity |
0.5mm Min.
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M |
Shelf width in the cavity |
0.5mm
Min. |
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| Surface layer・Inner layer |
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| Cavity |
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Application Notes
Brush up your circuit
Basic Knowledge
