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| Automotives applications (ECU, Power Windows), Power supply devices (DC/DC converters, AC/DC converters, Stabilizer, Lithium ion battery charger circuit) Industry devices (control circuits), Telecommunication equipment (Telephone switchboard, LAN, Transceivers, VCO, VTXO) |
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Adjustment processes are decreased by function and ratio trimmings. |
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High density mounting by bonding (COB). |
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Various types of package are available. |
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High reliability achieved by KOA's original thick film technology. |
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Each constructional element of thick film printed circuit substrate and printed board has optimized material. Inner
connecting solder is lead-free. |
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Copper Thick Film Circuit Substrates |
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Thick film printed circuit substrate applies the non-noble metal paste(conductive paste and resistive paste) and receives the many total inquiries including material selecting, pattern designing and mass production. |
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| KA |
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7777 |
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T |
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| Product Code |
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KOA Ref. No. |
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Terminal Surface Material |
KA : Hybrid IC
SC : Non-Noble |
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D : SnAgCu
T : Sn
Nil : Sn/Pb |
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| KA / SC Series |
Substrate materials |
Item |
Printing |
Mounting |
Bonding |
Alumina |
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Glass epoxy |
× |
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Conductors • Resistors |
Item |
Ag-Pd |
Ag-Pt |
Cu |
Conductor resistance |
18mΩ/□/15μm |
5mΩ/□/10μm |
2mΩ/□/20μm |
Heat shock |
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RuO2 |
5Ω  10MΩ ±100×10 -6/K |
10Ω 1MΩ±100×10 -6/K |
Mounting |
Item |
Specifications |
COB |
Au Wire, Al Wire |
BGA |
0.8mm Pitch |
QFP |
0.4mm Pitch |
Chip |
0.6mm×0.3mm (0.4mm×0.2mm) |
Package • Outside terminals |
Package |
Lead pitch |
SIP |
1.8mm, 2.0mm, 2.5mm, 2.54mm |
DIP, SOP |
1.27mm, 1.8mm, 2.54mm |
ZIP |
2.54mm |
Over coating • Plating |
Over Coating |
Color |
UL Standard |
Epoxy metamorphic phenol |
Black
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94 V0 approved |
Epoxy |
Black |
94 V1 approved |
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Application Notes
Brush up your circuit
Basic Knowledge
