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HOME>Products TOP>Thermal Sensors>Platinum Thermal Sensors (SDT73 Platinum thin Film Thermal Chip Sensors )

Thermal SensorsPlatinum Thin Film Thermal Chip Sensors[SDT73]

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Construction Features Applications Dimensions Type Designation
Ratings Temperature Characteristics      
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Thermal Sensors/Platinum Thin Film Thermal Chip Sensors SDT73
Coating color : Black
  Construction
   
Thermal Sensors/Platinum Thin Film Thermal Chip Sensors SDT73 Construction
1. Protective coating
2. Platinum thin film
3. Inner electrode
4. Ni plating
5. Solder plating
6. Ceramic substrate
 
Features
 
SMD platinum thin film thermal sensors.
T.C.R. is in accordance with JIS,DIN standards.
Suitable for temperature control in various industrial equipment.
Suitable for both flow and reflow solderings.
Products meet RoHS requirements.
 
 
Applications
 
Temperature compensation for various kinds of sensor drive circuits.
Temperature compensation for telecommunication and measuring equipment.
Temperature compensation for Hybrid ICs.
 
 
Dimensions
Type
(Inch Size Code)
Dimensions(mm) Weight (g)
(1000pcs)
L W c d t
2B
(1206)
3.20.2 1.60.2 0.50.3 0.50.3 0.50.15 9.0
   
Type Designation
SDT73   2B   T   TE   100   F   3850
           
Product Code   Size   Terminal Surface Material   Taping   Nominal Resistance   Resistance Tolerance T.C.R.
×10-6/K
    2B : 3.2×1.6mm   T : Sn
  TEK : 4mm pitch
plastic embossed
(1,000pcs)
TE : 4mm pitch
plastic embossed
(5,000pcs)
BK : Bulk
  100 : 100
500 : 500
  C : 0.2‰
F : 1‰
   
     
For further information on taping,please refer to Packagings For Chip Components.
   
Ratings

Type Resistance at 0 Resistance Tolerance
*1
Thermal Time Constant*2 Thermal Dissipation Constant*2 T.C.R.
×10-6/K
T.C.R. Tolerance
×10-6/K
Operating Temperature Range Power Rating*3 Taping & Q'ty/Reel(pcs)
TEK TE
SDT73
2B
100
500
C : 0.2%
F : 1%
6.5s 2.4mW/ 3850 50 -55 - +155 0.063W 1,000 5,000
*1
Please consult with us about the products equivalent to class B of JIS.
*2 Thermal time constant and thermal dissipation constant are reference values, which are values of elements and vary with connecting or fixing methods. Thermal dissipation constant is approx. 4mW/ under the surface mounting condition.
*3 Specified current is a current value that is used at reliability test under the condition of self heat-generation that can be disregarded. Oridinarily recommended measuring currents are 1mA for 100 and 0.1mA for 500.

   
Temperature Characteristics

Thermal Sensors/Platinum Thin Film Thermal Chip Sensors SDT73 Temperature Characteristics
Approximate Expression for Resistance-Temperature Characteristics

-55 - 0 : RT=R0 {1+C1T+C2T2+C3 (T-100)T3}

0 - +125 : RT=R0 (1+C1T+C2T2)

RT : Resistance value at T
R0 : Resistance value at 0
T : Ambient temperature()
Constants C1, C2, C3

C1=3.9083×10-3-1
C2=-5.775×10-7-2
C3=-4.183×10-12-4

 
Precautions for Use
 
  When measuring current higher than rated current (100 : 1mA, 500 : 0.1mA) is used, calculate a rise in temperature by self-heating and confirm the error range.

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