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 Construction |
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| 1. |
Protective coating |
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4. |
Sn plating |
| 2. |
Fuse element |
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5. |
Cu/Ni plating |
| 3. |
Inner electrode |
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6. |
Ceramic substrate |
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Features |
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1005 size miniature and light chip current
fuses for the secondary circuit. An occupied area reducible. |
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Excellent in mechanical strength. |
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The original construction and manufacturing
method make the fusing characteristics stable. |
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Low power consumption and less voltage
dropping possible due to low internal resistance. |
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Suitable for over current protection of
circuit block in small electronic devices. |
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Suitable for reflow soldering. |
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Products meet EU-RoHS requirements. |
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Approvals Awarded |
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UL248.14 File No.E131375 |
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c-UL(CSA)C22.2 No.248.14 File No.E131375 |
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Applications |
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Cellular-telephones |
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Digital still cameras |
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PDAs |
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Type
(Inch Size Code) |
Dimensions (mm) |
Weight (g)
(1000pcs) |
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L
|
W
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c
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d
|
t |
| TF10BN
(0402)
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1.0  0.1 |
0.5 0.05 |
0.2 0.1 |
0.25 0.1 |
0.4 0.05 |
0.68 |
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Contact us when you have control request for environmental hazardous material other than the substance specified by EU-RoHS.
For further information on taping, please refer to Packagings For Chip Components. |
| Type |
Marking |
Rated
Current |
Fusing
Time |
Internal
R.
(m ) Max. |
Rated
Voltage |
Rated
Ambient Temp. |
Operating
Temperature
Range |
Taping &
Q'ty/Reel (pcs) |
| TB |
| TF10BN0.20 |
A
|
0.20A
|
Open within 5 sec.
at 200% rated current.
Refer to the graph of fusing characteristics. |
1990
|
24V
|
+70  |
-55  +125 |
10,000
|
|
TF10BN0.25
|
C
|
0.25A
|
1270
|
| TF10BN0.315 |
D |
0.315A |
850 |
| TF10BN0.50 |
F |
0.50A |
320 |
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TF10BN0.63
|
I
|
0.63A
|
200
|
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TF10BN0.80
|
K
|
0.80A
|
135
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TF10BN1.00
|
L
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1.00A
|
115
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TF10BN1.25
|
M
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1.25A
|
90
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TF10BN1.60
|
N
|
1.60A
|
58
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TF10BN2.00
|
S
|
2.00A
|
42
|
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TF10BN2.50
|
T
|
2.50A
|
35
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Rated current needs to be derated if used at an ambient temperature 70 or above. Refer to the derating coefficient on the left figure. |
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Fusing Characteristics(Average Fusing Time) |
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Application Notes
Brush up your circuit
Basic Knowledge
