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 Construction |
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| 1. |
Protective coating |
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4. |
Sn plating |
| 2. |
Fuse element |
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5. |
Cu/Ni plating |
| 3. |
Inner electrode |
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6. |
Ceramic substrate |
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Features |
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Small and light chip current fuses for
the secondary circuit. |
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The original manufacturing method makes
the fusing characteristics stable. |
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Able to reduce an occupied area. |
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Low power consumption and less voltage
dropping due to low internal resistance. |
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Suitable for over current protection of
circuit block in small electronic devices |
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Suitable for both flow and reflow solderings. |
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Products meet EU-RoHS requirements. |
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Approvals Awarded |
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UL248.14 File No.E131375 |
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c-UL(CSA)C22.2 No. 248.14 File No.E131375 |
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Applications |
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Notebook personal computers |
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HDDs, CD-ROMs |
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Mobile phones |
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Camcorders |
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Digital still camera |
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Type
(Inch Size Code) |
Dimensions (mm) |
Weight (g)
(1000pcs) |
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L
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W
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c
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d
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t |
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TF16SN
(0603)
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1.6  0.2
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0.8  0.1
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0.3  0.1
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0.3  0.1
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2.15
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Contact us when you have control request for environmental hazardous material other than the substance specified by EU-RoHS.
For further information on taping, please refer to Packagings For Chip Components. |
| Type |
Marking |
Rated Current |
Fusing Time |
Internal R.
(m ) Max. |
Rated Voltage |
Rated Ambient Temp. |
Operating Temperature Range |
| TF16SN0.20 |
A |
0.20A |
Open within 1 sec. at 200% rated current.
Refer to the graph of fusing characteristics.
|
1500 |
32V
|
+70 
|
-40  +125 
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TF16SN0.25
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C
|
0.25A
|
960
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TF16SN0.315
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D
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0.315A
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600
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TF16SN0.40 |
H |
0.40A |
440 |
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TF16SN0.50
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F
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0.50A
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300
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TF16SN0.63
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I
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0.63A
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190
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TF16SN0.70 |
J |
0.70A |
170 |
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TF16SN0.80
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K
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0.80A
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135
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TF16SN1.00
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L
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1.00A
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103
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TF16SN1.25
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M
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1.25A
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78
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TF16SN1.60
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N
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1.60A
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58
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TF16SN2.00
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S
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2.00A
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47
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TF16SN2.50
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T
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2.50A
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38
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TF16SN3.15
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U
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3.15A
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28
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Rated current needs to be derated if used at an ambient temperature 70 or above. Refer to the derating coefficient on the left figure. |
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Fusing Characteristics(Average Fusing Time) |
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