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| We have lined up LTCC, Hybrid ICs. |

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LTCC Substrate |
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| Use for various applications including high density module substrate, high frequency module substrate, component-embedded substrate, interposer and IC package. |

Category |

Type |
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| LTCC substrate•Package substrate |
KLC |
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Hybrid IC |
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| Functional blocks in hybrid IC enables downsizing and model change as well as reduces inspection processes. |

Category |

Type |
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| Custom hibrid IC |
KA/SC |
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| Multi Chip Module |
MCM |
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Common Specification |
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| Items |
PDF |
| Minimum Ordered Quantity |
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| Recommended Pad Dimensions |
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| Packagings
For Chip Components |
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| Axial Tapings |
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| Radial Taping |
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| Forming |
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| Color code•Resistance marking•E series numbers |
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