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LTCC substrate, Hybrid IC
We have lined up LTCC, Hybrid ICs.
Use for various applications including high density module substrate, high frequency module substrate, component-embedded substrate, interposer and IC package.
| Category | Type | |
|---|---|---|
| LTCC substrate•Package substrate | KLC |  |
Functional blocks in hybrid IC enables downsizing and model change as well as reduces inspection processes.
| Category | Type | |
|---|---|---|
| Custom Hybrid IC | KA | |
| Multi Chip Module | MCM | |
| Items | |
|---|---|
| Minimum Ordered Quantity | |
| Recommended Pad Dimensions | |
| Packagings For Chip Components | |
| Axial Tapings | |
| Radial Taping | |
| Forming | |
| Color code•Resistance marking•E series numbers | |